Video:
LY M770 economic upgraded IR bga model BGA Rework station 220V 2 zones manual operation 1900W
Specifications:
01. Applicable to laptop motherboard, desktop motherboard, XBOX-360, server motherboard, digital products etc..
02. Two heating zones, independant heating, upper heating 300W, bottom preheating 1600W
03. Maximum heating temperature : 500 degree
04. Used high accurate Intelligent temperature controller, make more accurate temperature controlling
05. Movable heater, easy and convinient to use
06. Infrared heating panel, independant controlling heating
07. Brilliant-designed Universal circuit board structural support, weld zone part non-support, none sink
08. Bottom preheater, used to preheat PCB, to make sure it non-deformation, maximum heating area 450 * 500mm
09. No limit for PCB thickness during desoldering
10. No limit for BGA chips size during desoldering, max size for 775CPU, min size for CCD grain
11. Dimension: L450 * W450 * H460mm
12. Power supply: 220V 5060Hz
13. Effective power: 1900W
14. Weight: 20kg
15. Factory bulk welding success rate up to 98%, machine warranty for 1 year
Specifications: | |
Heating Zones | 2 zones |
Top Size | 60*60mm |
Top Power | 300W |
Bottom size | 240*80mm*2 pcs |
Bottom Power | 1600W |
Machine size | 450*450*460mm |
Power | 220V,50/60HZ |
Gross weight | 20KG |
Operation | Manual |
Software | Not support |
