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Affordable Wholesale LY IR8500 IR BGA Rework Soldering Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated

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Working Video:


LY IR8500 IR BGA Rework Soldering Station Reballing Kit Motherboard Mobile Phone Chip Repairing Rework Machine IR6500 Updated

Video of IR8500:

https://www.youtube.com/watch?v=8wTTk9LEnf8&feature=youtu.be

Feature:

This is economic BGA model,substitute of IR-PRO-SC,if do small motherboard,can choose IR6500,if do big board,can choose IR8500.

1.CE Certification

2.LY IR8500 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

3.LY IR8500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.
4.It can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.

5.It sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring.

6.The BGA rework station the technology of closed-loop temperature control ensures accurate temperature process and even heat distribution.
7.Machine overall system integration Design, Rework station more integrated workbench area occupied by smaller, Didn't mixed and disorderly of cables.

Introduction

LY IR8500 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

LY IR8500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.

How to use

Please refer to the CD of USER MANUAL and to see how to use

Please refer to the SETTING OF THE TEMPEATURE PARAMETERS MANUAL HERE and to see how to set temperature

Technical Parameters

Basic Parameters


Zones

2

Heating

IR

Operations

Manual / Software

Dimension

L780mmx W450mmx H260mm

Weight

18kg

Total weight

About 21 kg, vary with the different need of the users

Electrical Parameters


Power

220V AC

Upper Heating

IR

Size of Upper heating

80mm x 80mm

Consumption of upper heating

450W

Bottom Heating

IR

Size of Bottom heating

400mm x200mm

Consumption of Bottom heating

1600W

General power

2050W

Temperature Control


Control mode of Upper

Independent temperature control, high-precision closed-loop


control, precision ± 0.5%, Alarm

Control mode of Bottom

Independent temperature control, high-precision closed-loop


control, precision ± 0.5%, NO Alarm

Rework Function


SMD

Suit for welding, remove or repair packaged devices


such as BGA,PBGA,CSP,multi-layer substrates, EMI


metallic shield product and solder/lead free Rework welding

Size of applicable chips

≤70mm x70 mm

Size of applicable PCB

≤400mm x305mm

Packing list:

1× IR8500 BGA rework station

1x LY IR cover set

1× power cable

1× usb to rs232 port cable (with CD)

1× thermocouple

4x pcb jig with screw

1 x bottom support

1× CD ofmanual and software(if not get, may be lost in customs, please contact us)









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