LK-007 Hot Air BGA Rework Station 220V Soldering Welding Machine with Vacuum Suction Pen XBOX-360 motherboard Repairing System
Parameters
Dimensions: 720*630*600mm
Power supply: 220V 50/60HZ
Effective power: 4200W
Machine weight: 48KG
Nozzles: 6pcs (18*18mm, 23*23mm, 42*42mm, 36*36mm; 29*29mm; 45*45mm, 50*50mm)
Pre-heating size: Max 500*670mm
Heating zones: 3 zones
Heating: Hot Air
Bottom hot air heating: 900W
Bottom infrared heating: 2800W
Upper hot air heating: 900W
Performance indicators and specifications.
LK-007 is suitable for repairing circuit boards such as notebook computer motherboards, desktop computer motherboards, server motherboards, and XBOX-360.
The heating head is controlled by a motor.
Three temperature zones are heated independently, with 900W hot air in the upper part, 900W hot air in the lower part, and 2800W infrared preheating.
The 7-inch touch screen man-machine interface displays the temperature curves of the three temperature zones in real time.
Precisely control the preheating and desoldering temperature, the temperature error is about 1 degree.
8 sections of heating + 8 sections of constant temperature control, can store 10,000 sets of temperature curves.
The standard configuration of 007 only needs one period of heating and one period of constant temperature to achieve the ideal welding effect, which is simple and reliable.
The high-power cross flow fan cools the circuit board quickly.
It has an audible alarm function when the desoldering is completed.
The electric vacuum suction pen sucks the BGA chip.
The support structure of the universal circuit board is excellent in design, and the welding area is not concave.
The infrared heating plate can individually control heating.
The optical alignment interface is reserved, which can be quickly upgraded to an optical alignment BGA rework station.
The preheating table at the lower part of the machine ensures that the board is not deformed, and can preheat the circuit board up to 500mm*670mm.
Standard configuration 6 nozzles, as large as 775CPU seat, as small as memory particles, can be welded.
