Infrared BGA reballing station LY IR6500 V.2 with 90MM bga stencil 184pcs kit pack
Introduction
IR6500 V.2 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.
IR6500 V.2 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.
Technical Parameters
Basic Parameters | |
Zones | 2 |
Operations | Manual / Software |
Heating | IR |
Dimension | L495mmx W480mmx H420mm |
Weight | 16kg |
Total weight | About 17 kg, vary with the differen need of the users |
Electrical Parameters | |
Power | 220V AC |
Upper Heating | IR |
Size of Upper heating | 80mm x 80mm |
Consumption of upper heating | 450W |
Bottom Heating | IR2400mm x2000m |
Size of Bottom heating | 2400mm x2000mm |
Consumption of Bottom heating | 1800W |
General power | 2300W |
Temperature Control | |
Control mode of Upper | Independent temperature control, high-precision closed-loop |
control, precision ± 0.5%, Alarm | |
Control mode of Bottom | Independent temperature control, high-precision closed-loop |
control, precision ± 0.5%, NO Alarm | |
Rework Function | |
SMD | Suit for welding, remove or repair packaged devices |
such as BGA,PBGA,CSP,multi-layer substrates, EMI | |
metallic shield product and solder/lead free Rework welding | |
Size of applicable chips | ≤70mm x70 mm |
Size of applicable PCB | ≤400mm x305mm |
with free gift (ABCD package , you can choose one ,We send C package by default)
