infrared BGA Soldering Rework machine LY M770 for motherboard chip repair
Specifications:
01. Applicable to laptop motherboard, desktop motherboard, XBOX-360, server motherboard, digital products etc.. 02. Two heating zones, independant heating, upper heating 300W, bottom preheating 1600W 03. Maximum heating temperature : 500 degree 04. Used high accurate Intelligent temperature controller, make more accurate temperature controlling 05. Movable heater, easy and convinient to use 06. Infrared heating panel, independant controlling heating 07. Brilliant-designed Universal circuit board structural support, weld zone part non-support, none sink 08. Bottom preheater, used to preheat PCB, to make sure it non-deformation, maximum heating area 450 * 500mm09. No limit for PCB thickness during desoldering 10. No limit for BGA chips size during desoldering, max size for 775CPU, min size for CCD grain 11. Dimension: L450 * W450 * H460mm 12. Power supply: 220V 5060Hz 13. Effective power: 1900W 14. Weight: 20kg 15. Factory bulk welding success rate up to 98%, machine warranty for 1 year RE:Not support communication by software with Com.if ship from russia , package will without free gift ,because russia hasn't this gifts!
