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Economic Upgraded IR BGA Model LY M770 BGA Rework station 220V 2 zones manual operation 1900W
Feature
This model maybe the cheapest 2 zones infrared bga rework station,if you are new bie,or have limited budget,you can consider of this model.
Specs | |
Zones | 2 zones |
Top Size | 60*60mm |
Top Power | 300W |
Bottom size | 240*80mm*2 pcs |
Bottom Power | 1600W |
Machine size | 450*450*460mm |
Power | 220V,50/60HZ |
Gross weight | 20KG |
Operation | Manual |
Software | Not support |
The parameters and performance indicators:
1. The rework station suitable for notebook computer motherboard, desktop computer motherboards, computer and server motherboard, motherboard, motherboard, large game machines, communications equipment, motherboards, LCD TV motherboard, motherboard, print circuit board repair.
2. The BGA chips rework station can be very effective in replacing the stack memory, the replacement of the BGA chip, memory below will not take slurry.
3. The rework station can be very successful in solving BGA chip heated foaming problem. (constant temperature 100 degrees available preheating.
4. Preheat to repair the motherboard 1-2 minutes. Then heating.
5. The rework station can replace CPU notebook memory slot to facilitate the.
6. BGA chip to be an easy job to replace glue sealing, sealing glue chip to the rubber (hot-air or in addition to adhesive glue).
7. The replacement of the BGA chip, the circuit board can not turn yellow.
8. The rework station using infrared preheating and infrared heating, lower preheating station, PCB board for preheating, ensure that the PCB plate can not be deformed, preheating station area of 245*180. Can fully meet the desktop and notebook computer repair.
9. Rational design of support structure, the replacement of the BGA chip is not deformation, very convenient and practical.
10. The rework station can do circuit board drying and circuit board shaping.
The rework station welding success rate is almost 99%, if can't achieve this goal, probably because of the new machine, please try it a few times.
Specifications
01. Applicable to laptop motherboard, desktop motherboard, XBOX-360, server motherboard, digital products etc..
02. Two heating zones, independant heating, upper heating 300W, bottom preheating 1600W
03. Maximum heating temperature : 500 degree
04. Used high accurate Intelligent temperature controller, make more accurate temperature controlling
05. Movable heater, easy and convinient to use
06. Infrared heating panel, independant controlling heating
07. Brilliant-designed Universal circuit board structural support, weld zone part non-support, none sink
08. Bottom preheater, used to preheat PCB, to make sure it non-deformation, maximum heating area 450 * 500mm
09. No limit for PCB thickness during desoldering
10. No limit for BGA chips size during desoldering, max size for 775CPU, min size for CCD grain
11. Dimension: L450 * W450 * H460mm
12. Power supply: 220V 5060Hz
13. Effective power: 1900W
14. Weight: 20kg
15. Factory bulk welding success rate up to 98%, machine warranty for 1 year
RE:Not support communication by software with Com.